DALI Thermal
Temperature Measurement Thermal CameraThe emergence of uncooled detectors has opened new opportunities for IR detection for both military and commercial applications. Development of such devices involves a lot of trade-offs between the different parameters that define the technological stack. These trade-offs explain the number of different architectures that are under worldwide development. The key factor is to find a high sensitivity and low noise thermometer materia³ compatible with silicon technology in order to achieve high thermal isolation in the smallest area as possible. Ferroelectric thermometer based on hybrid technology and electrical resistive thermometer based (microbolometer) technology are under development. However, ferroelectric materia³ suffers from the difficulty to achieve a high figure of merit from thin film that is needed for monolithic structure development. Besides, the microbolometer technology, well adapted for thin film process, leads to higher performance at the expense of more complex readout integrated circuit design.

DLD384
 Uncooled FPA Detector thermal imaging detector Tech Specs 


The emergence of uncooled detectors has opened new opportunities for IR detection for both military and commercial applications. Development of such devices involves a lot of trade-offs between the different parameters that define the technological stack. These trade-offs explain the number of different architectures that are under worldwide development. The key factor is to find a high sensitivity and low noise thermometer materia³ compatible with silicon technology in order to achieve high thermal isolation in the smallest area as possible. Ferroelectric thermometer based on hybrid technology and electrical resistive thermometer based (microbolometer) technology are under development. However, ferroelectric materia³ suffers from the difficulty to achieve a high figure of merit from thin film that is needed for monolithic structure development. Besides, the microbolometer technology, well adapted for thin film process, leads to higher performance at the expense of more complex readout integrated circuit design.


Items

DLD384

Detector type

a-Si

Array size

384×288

Pixel pitch

17×17μm

Spectral response

8~14μm

Temperature control

TEC

Frame rate

≤60Hz

NETD(f/1,300K,50Hz)

40mK/60mK

Responsivity

≥10mV/K

Operability

≥99.5%

Consumption(Typ)(without TEC)

200mW

Dimension (pins excluded)

32×23.5×7.1mm

Weight

≤20g

Operating temperature

-40℃~+60℃

Storage temperature

-40℃~+85℃

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